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by E. Ajith Amerasekera,D. S. Campbell
Download Failure Mechanisms in Semiconductor Devices fb2
Engineering
  • Author:
    E. Ajith Amerasekera,D. S. Campbell
  • ISBN:
    0471914347
  • ISBN13:
    978-0471914341
  • Genre:
  • Publisher:
    Wiley; 1 edition (December 28, 1987)
  • Pages:
    220 pages
  • Subcategory:
    Engineering
  • Language:
  • FB2 format
    1296 kb
  • ePUB format
    1843 kb
  • DJVU format
    1482 kb
  • Rating:
    4.7
  • Votes:
    593
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The book analyses the main failure mechanisms in terms of cause, effects and prevention and explains the mathematics behind reliability analysis.

oceedings{reMI, title {Failure Mechanisms in Semiconductor Devices}, author {E. Ajith Amerasekera and Farid N. Najm and D. S. Campbell}, year {1987} }. E. Ajith Amerasekera, Farid N. Najm, D. Campbell. Introduction Reliability Theory Failure Mechanisms Failure Mechanisms and Device Technologies Packaging Screening Accelerated Testing Physical Failure Analysis Techniques Reliability Prediction and Failure Modelling Quality Assurance Conclusions.

Failure mechanisms in semiconductor devices. Ekanayake Ajith Amerasekera, D. Introduction Reliability Theory Failure Mechanisms Failure Mechanisms and Device Technologies Packaging Screening Accelerated Testing Physical Failure Analysis Techniques Reliability Prediction an. More). Thermal failure in semiconductor devices. Vincent M. Dwyer, Andrew James Franklin, D. Abstract A first principles approach to the problem of thermal breakdown in semiconductor devices is developed using Green's function formalism.

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This type of device failure is one of thedominant sources of yield loss in MEMS. In general, the failurerequires two different phenomena. First (a) the device must besubject to a force sufficiently strong to collapse the elasticmember thus bringing it in contact with the substrate. b) Aftercontact is established and the force removed, the intersolidadhesion must exceed the elastic member restoring force hence keeping the device permanently pinned to the substrate.

Book Publishing WeChat. Key Issues for Implementing Smart Polishing in Semiconductor Failure Analysis. Investigation of the Force Transfer Mechanisms for Open Hoop FRP Strips Bonded on R/C Beams with or without Anchoring Devices. 1987) Failure Mechanisms in Semiconductor Devices. John Wiley & Sons Ltd. has been cited by the following article: TITLE: Fault Tolerance Limits and Input Stimulus Selection Using an Implemented FPGA-Based Testing System. AUTHORS: Papakostas K. Dimitrios, Pouros P. Sotirios, Vassios D. Vassilios. Ajith Amerasekera. Learn More at LibraryThing. ISBN 9780471914341 (978-0-471-91434-1) Hardcover, Wiley, 1987. Find signed collectible books: 'Failure Mechanisms in Semiconductor Devices'. Coauthors & Alternates. Campbell at LibraryThing.

Discover Book Depository's huge selection of E Ajith Amerasekera books online. Free delivery worldwide on over 20 million titles. Failure Mechanisms in Semiconductor Devices. ESD in Silicon Integrated Circuits.

Ajith Amerasekera from the Texas Instruments In. in Dallas, TX was named Fellow of the Institute of Electrical and Electronics Engineers (IEEE) in 2012 for leadership in semiconductor innovation and contributions to circuit design. Amerasekera was Chief Technical Officer for TI's ASIC Business Unit. is in Electrical Engineering and Physics.

Thoroughly surveys the physics of failure mechanisms in semiconductor devices, from the semiconductor dye itself to the packaging and interconnections. Its specific intention is to identify the processes leading to damage and the techniques used to repair or detect it. Discusses and critiques accelerated lifetesting and how the various tests apply to different failure mechanisms. Also provides a critical review of reliability modelling and estimation and techniques, and quality assurance and screening techniques, emphasizing the complexity of present-generation integrated circuits. Throughout, suggestions are offered on ways to improve the quality of devices.